By Chuan Seng Tan,Kuan-Neng Chen,Steven J. Koester
Three-dimensional (3D) integration is pointed out as a potential road for non-stop functionality development in built-in circuits (IC) because the traditional scaling process is confronted with extraordinary demanding situations in basic and fiscal limits. Wafer point 3D IC can take numerous kinds, and so they frequently comprise a stack of a number of thinned IC layers which are vertically bonded and interconnected through via silicon through TSV.
There is an extended string of advantages that you'll derive from 3D IC implementation reminiscent of shape issue, density multiplication, more advantageous hold up and gear, superior bandwidth, and heterogeneous integration. This ebook provides contributions through key researchers during this box, protecting motivations, expertise systems, purposes, and different layout concerns.
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3D Integration for VLSI Systems by Chuan Seng Tan,Kuan-Neng Chen,Steven J. Koester
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